Browse "MS-Conference Papers(학술회의논문)" by Author Paik, Kyung W.
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| CONDUCTIVE ADHESIVE FILMS (ACFs AND NCFs) MATERIALS FOR ELECTRONICS PACKAGING APPLICATIONS Paik, Kyung W., Pan Pacific Microelectronics Symposium (Pan Pacific), IEEE, 2019-02 |
| The multilayer-modified Stoney’s formula for laminated polymer composites on a silicon substrate Kim, Jin S.; Paik, Kyung W.; Oh, Seung H.; Kim, Y.K., JOURNAL OF APPLIED PHYSICS, VOLUME 86, NUMBER 10, pp.5474-5479, 1998-05-25 |
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