CONDUCTIVE ADHESIVE FILMS (ACFs AND NCFs) MATERIALS FOR ELECTRONICS PACKAGING APPLICATIONS

Abstract

Due to the increasing demand for higher performance, greater flexibility, smaller size, and lighter weight in mobile and wearable electronic products, there have been growing needs of various electronic packaging products and fine pitch interconnection technologies. To realize various state of -art mobile and wearable electronic products, fine pitch and flexible packaging & interconnection technologies are needed. As one of the promising fine pitch and flexible packaging and interconnection technologies, conductive adhesive films materials such as ACFs(Anisotropic Conductive Films) and NCFs(Non Conductive Films) are widely used now.