DSpace at KOASAS
Browsing DSpace

Browse "MS-Conference Papers(학술회의논문)" by Author Ostmann, A

A to Z

All 0-9

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

or enter first few letters:

Showing results 1 to 4 of 4

1
Comparison of interfacial reactions and reliabilities of Sn3.5Ag, Sn4.0Ag0.5Cu, and Sn0.7Cu solder bumps on electroless Ni-P UBMs

Jeon, YD; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 53rd Electronic Components and Technology Conference 2003, pp.1203 - 1208, IEEE, 2003-05-27

2
Formation and Characterization of Co-Reinforced Sn-3.5Ag Solder

Jeon, Duk Young; Lee, JS; Chu, KM; Patzelt, R; Manessis, D; Ostmann, A, KAIST/GIST/Postech/Kyoto/Tohoku Univ. Joint Symposium, 2006

3
Formation and characterization of cobalt-reinforced Sn-3.5Ag solder

Lee, JS; Chu, KM; Jeon, Duk Young; Patzelt, R; Manessis, D; Ostmann, A, IEEE 56th Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2006-05-30

4
Studies on the interfacial reactions between electroless Ni UBM and 95.5Sn-4.0 Ag-0.5 Cu alloy

Jeon, YD; Nieland, S; Ostmann, A; Reichl, H; Paik, Kyung-Wook, 52nd Electronic Components and Technology Conference, pp.740 - 746, IEEE, 2002-05-28

Discover

rss_1.0 rss_2.0 atom_1.0