Browse "MS-Conference Papers(학술회의논문)" by Author Jang, Se-Young
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| Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems Jang, Se-Young; Paik, Kyung-Wook, 50th Electronic Components and Technology Conference, pp.64 - 68, IEEE, 2000-05-01 |
| The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB solder bumps interface for flip chip interconnection Jang, Se-Young; Paik, Kyung-Wook, Proceedings of the 1998 MRS Spring Symposium, pp.67 - 72, Proceedings of the 1998 MRS Spring Symposium, 1998-04-14 |
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