The Study on the Under Bump Metallurgy (UBM) and 63SN-37PB solder bumps interface for flip chip interconnection

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Publisher
Proceedings of the 1998 MRS Spring Symposium
Issue Date
1998-04-14
Language
ENG
Citation

Proceedings of the 1998 MRS Spring Symposium, v.515, pp.67 - 72

ISSN
0272-9172
URI
http://hdl.handle.net/10203/119564
Appears in Collection
MS-Conference Papers(학술회의논문)
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