Browse "MS-Conference Papers(학술회의논문)" by Author Chang, TC

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20 µm-pitch complaint-bump-bonded chip-on-flex by pre-applied wafer level adhesives

Chuang, CC; Lu, ST; Chang, TC; Suk, KL; Paik, Kyung-Wook, IMPACT Conference 2009 International 3D IC Conference, pp.56 - 59, 2009-10-21

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