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1
Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint

Paik, Kyung-Wook; Ahn, Seung Young; Rhu, Woong Hwan; Yim, Myung-Jin; Lee, Jun Ho; Jeon, Young-Doo; Kim, Woo Poung; et al, APACK'99 Symposium on Advances in Packaging, pp.353 - 356, 1999-12-01

2
Microwave frequency model of flip-chip interconnects using anisotropic conductive film

Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06

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