Browse "MS-Conference Papers(학술회의논문)" by Title
Showing results 2881 to 2900 of 7321
| Flexible Vertical GaN MicroLEDs for Transparent Biomedical Stimulator PARK, SANG HYUN; Lee, Haneol; Lee, Keon Jae, 2022 MRS SPRING MEETING & EXHIBIT, Materials Research Society, 2022-05-12 |
| Flexible vertical inorganic light-emitting diodes for biomedical applications Lee, Seung Hyun; Lee, Haneol; Sin, Jeongho; Lee, Keon Jae, 2016년도 한국재료학회 추계학술대회, 사단법인 한국재료학회, 2016-11-18 |
| Flexible Ⅲ-Ⅴ Compound LED for the Future Consumer Electronics Lee, Seung Hyun; Lee, Haneol; Lee, Keon Jae, 제 23회 한국반도체학술대회, 성균관대학교, 한국반도체산업협회, 한국반도체연구조합, 2016-02-23 |
| Flexible, Untrasmooth, Highly Transparent, and Conductive Cu@Ni Core-Sheath Nanowire Embedded in Colorless Polyimide Films Youn, Doo Young; Luo, Zhenhao; Kim, Il Doo, PACRIM 11, Pacific Rim Ceramic Societies, 2015-09-02 |
| Flip Chip Assembly on Board using Anisotropic Conductive Adhesive/Film and Nickel-Gold Bump Paik, Kyung-Wook, Advances in Electronic Packaging, pp.367 - 372, 1999-06-01 |
| Flip Chip Assembly on Board using Anisotropic Conductive Film and Electroless Ni/Au Bumps 백경욱, 한국재료학회 추계학술대회, pp.81 - 81, 한국재료학회, 1998-11-01 |
| Flip chip assembly on organic boards using anisotropic conductive adhesives (ACAs) and nickel/gold bumps Yim, MJ; Jeon,YD; Paik, Kyung-Wook, 2000 Electronics Packaging Technology Conference(3rd EPTC), pp.378 - 384, EPTC, 2000-12-01 |
| Flip chip assembly on organic boards using anisotropic conductive adhesives/films and nickel/gold bump Yim, MJ; Jeon, YD; Paik, Kyung-Wook, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, 1999-06-13 |
| Flip chip assembly on PCB substrates with coined solder bumps Nah, JW; Paik, Kyung-Wook; Cho, SJ; Kim, WH, 53rd Electronic Components and Technology Conference, pp.244 - 249, IEEE, 2003-05-27 |
| Flip chip interconnection using anisotropic conductive adhesives for RF and high frequency applications Yim, MJ; Jung, IH; Choi, HK; Kim, K; Hwang, JS; Ahn, JY; Kwon, W; et al, 53rd Electronic Components and Technology Conference 2003, pp.1398 - 1403, IEEE, 2003-05-27 |
| Flip-Chip-on-Glass(FCOG) Technology using Electroless Ni/Cu/Au bump and ACF for LCD Packaging Paik, Kyung-Wook, Liquid Crystal Materials and Device '99, pp.199 - 204, 1999-09-01 |
| fluoride based cathode for lithum rechargeable batteries :novel approach in material design 강기석, 한국전자학회 10주년 기념 학술대회, -, 2011-12-02 |
| Fluorinated Epoxy Hybrid Material for Transparent Low-k Passivation Layer on Oxide Thin Film Transistors Lee, Injun; Kim, Yongho; Shin, Jungcheol; Park, Sang-Hee Ko; Bae, Byeong-Soo, 제 18회 국제정보디스플레이 학술대회(IMID 2018), 한국디스플레이산업협회, 2018-08 |
| Fluorinated Epoxy Siloxane Hybrid Materials for Bio-fluidic Barrier on Flexible Electronics Lee, Injun; Lee, Wonryung; Bae, Byeong-Soo, 2019 MRS Fall Meeting, Materials Research Society, 2019-12-04 |
| Fluorinated Epoxy Siloxane Hybrid Materials with Low Dielectric for Inter Layer Dielectric 이인준; 김용호; 배병수, 대한금속 재료학회 2018 춘계 학술대회, 대한금속 재료학회, 2017-04-27 |
| Fluorinated Organic and Inorganic Hybrid Mold for Nanoimprint Lithography Bae, Byeong-Soo; Choi, DG; Lee, ES; Jeong, JH; Lee, DI; Shin, YJ, NANO 2005, 2005 |
| Fluorinated organic-inorganic hybrid materials for nano-imprints and soft-lithography 배병수; 김우수; 최대근; 진정호, 한국재료학회, 한국재료학회, 2005 |
| Fluorinated Silicon Nitride 박막의 조성과 광학성질 노광수; 배병수; 전병혁; 이준성; 김대원; 성태현, 한국요업학회 추계학술발표대회, 한국요업학회, 1997-01-01 |
| Flux Function added Solder Anisotropic Conductive Films (ACFs) for High Power and Fine Pitch Assemblies Kim, Seung-Ho; Choi, Yongwon; Kim, Yoosun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1713 - 1716, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
| Focusing and Leveling System Using PSDs for the Wafer Steppers KANG SANG WON, SPIE997, 1994-01-01 |
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