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A Universal Method for the Lamination of Arbitrary Stretchable Substrate Pairs without Compromising the Elastic Properties of the Substrates Jeong, Kihoon; Lee, Yujin; Kim, Youson; Mun, Hyeonwoo; Kyung, Ki-Uk; Im, Sung Gap, Display Week 2022, pp.922 - 925, SID, 2022-05-12 |
Sub-micrometer Bonding Method for Stretchable Substrates Jeong, Kihoon; Lee, Yujin; Kim, Yuson; Moon, Hyunwoo; Kyung, Ki-Uk; Im, Sung Gap, NANO KOREA 2022 Symposium, Korea Nanotechnology Research Society (KoNTRS), 2022-07-08 |
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