Effects of Thickness, Doping Concentration and Flow Rate of WF6 on the Electrical Resistivity of Tungsten Silicide Films

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dc.contributor.authorC.M.Leeko
dc.contributor.authorC.S.Hanko
dc.contributor.authorJ.G.Leeko
dc.contributor.authorH.B.Imko
dc.date.accessioned2013-02-25T02:12:44Z-
dc.date.available2013-02-25T02:12:44Z-
dc.date.created2012-02-06-
dc.date.created2012-02-06-
dc.date.issued1990-
dc.identifier.citationJOURNAL OF THE KOREAN PHYSICAL SOCIETY, v.3, pp.410-
dc.identifier.issn3744-4884-
dc.identifier.urihttp://hdl.handle.net/10203/59023-
dc.languageKorean-
dc.publisher한국물리학회-
dc.titleEffects of Thickness, Doping Concentration and Flow Rate of WF6 on the Electrical Resistivity of Tungsten Silicide Films-
dc.typeArticle-
dc.type.rimsART-
dc.citation.volume3-
dc.citation.beginningpage410-
dc.citation.publicationnameJOURNAL OF THE KOREAN PHYSICAL SOCIETY-
dc.contributor.localauthorH.B.Im-
dc.contributor.nonIdAuthorC.M.Lee-
dc.contributor.nonIdAuthorC.S.Han-
dc.contributor.nonIdAuthorJ.G.Lee-
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