DC Field | Value | Language |
---|---|---|
dc.contributor.author | YI, KS | ko |
dc.contributor.author | KIM, JB | ko |
dc.contributor.author | KIM, KJ | ko |
dc.contributor.author | Chun , Soung Soon | ko |
dc.date.accessioned | 2013-02-24T12:06:35Z | - |
dc.date.available | 2013-02-24T12:06:35Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 1987-12 | - |
dc.identifier.citation | THIN SOLID FILMS, v.155, no.1, pp.87 - 95 | - |
dc.identifier.issn | 0040-6090 | - |
dc.identifier.uri | http://hdl.handle.net/10203/57012 | - |
dc.language | English | - |
dc.publisher | ELSEVIER SCIENCE SA LAUSANNE | - |
dc.title | THE EFFECTS OF DEPOSITION VARIABLES ON DEPOSITION RATE IN THE CHEMICAL VAPOR-DEPOSITION OF SILICON-NITRIDE | - |
dc.type | Article | - |
dc.identifier.wosid | A1987L475400008 | - |
dc.type.rims | ART | - |
dc.citation.volume | 155 | - |
dc.citation.issue | 1 | - |
dc.citation.beginningpage | 87 | - |
dc.citation.endingpage | 95 | - |
dc.citation.publicationname | THIN SOLID FILMS | - |
dc.identifier.doi | 10.1016/0040-6090(87)90455-X | - |
dc.contributor.localauthor | Chun , Soung Soon | - |
dc.contributor.nonIdAuthor | YI, KS | - |
dc.contributor.nonIdAuthor | KIM, JB | - |
dc.contributor.nonIdAuthor | KIM, KJ | - |
dc.type.journalArticle | Article | - |
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