ADHESION MECHANISMS OF THICK-FILM CONDUCTORS
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Kim, Ho Gi | ko |
| dc.contributor.author | ROTHLINGSHOFER, W | ko |
| dc.contributor.author | TOMANDL, G | ko |
| dc.date.accessioned | 2013-02-24T10:54:33Z | - |
| dc.date.available | 2013-02-24T10:54:33Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 1979 | - |
| dc.identifier.citation | SOLID STATE TECHNOLOGY, v.22, no.3, pp.62 - 66 | - |
| dc.identifier.issn | 0038-111X | - |
| dc.identifier.uri | http://hdl.handle.net/10203/56627 | - |
| dc.language | English | - |
| dc.publisher | PENNWELL PUBL CO SOLID STATE TECHNOLOGY OFFICE | - |
| dc.title | ADHESION MECHANISMS OF THICK-FILM CONDUCTORS | - |
| dc.type | Article | - |
| dc.identifier.wosid | A1979GM64000007 | - |
| dc.type.rims | ART | - |
| dc.citation.volume | 22 | - |
| dc.citation.issue | 3 | - |
| dc.citation.beginningpage | 62 | - |
| dc.citation.endingpage | 66 | - |
| dc.citation.publicationname | SOLID STATE TECHNOLOGY | - |
| dc.contributor.localauthor | Kim, Ho Gi | - |
| dc.contributor.nonIdAuthor | ROTHLINGSHOFER, W | - |
| dc.contributor.nonIdAuthor | TOMANDL, G | - |
| dc.type.journalArticle | Article | - |
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