The Effect of Descaling Treatments on Intermetallic Formation and Thermomechanical Stability of an Electroplated Tin/Lead Layer in a Semiconductor Leadframe Alloy

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Publisher
Chapman and Hall
Issue Date
1994
Language
English
Citation

JOURNAL OF MATERIALS SCIENCE LETTERS, v.13, pp.1465 - 1468

ISSN
0261-8028
URI
http://hdl.handle.net/10203/56095
Appears in Collection
RIMS Journal Papers
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