전해도금을 이용한 미세 피치 Au bump 제조 방법 및 접합에 관한 연구Fabrication and bonding of fine pitch Au bump by electroplating
- Advisors
- 유진researcher; Yu, Jinresearcher
- Description
- 한국과학기술원 : 신소재공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 2004
- Identifier
- 238338/325007 / 020023632
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 신소재공학과, 2004.2, [ viii, 76 p. ]
- Keywords
본딩; 3차원 패키징; 패키징; 골드 범프; 파인피치범프; FINE PITCH BUMP; BONDING; 3D PACKAGING; PACKAGING; AU BUMP
- Appears in Collection
- MS-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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