전해도금을 이용한 미세 피치 Au bump 제조 방법 및 접합에 관한 연구 = Fabrication and bonding of fine pitch Au bump by electroplating

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dc.contributor.advisor유진-
dc.contributor.advisorYu, Jin-
dc.contributor.author최준식-
dc.contributor.authorChoi, Joon-Sik-
dc.date.accessioned2011-12-15T01:46:41Z-
dc.date.available2011-12-15T01:46:41Z-
dc.date.issued2004-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=238338&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/51624-
dc.description학위논문(석사) - 한국과학기술원 : 신소재공학과, 2004.2, [ viii, 76 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.subject본딩-
dc.subject3차원 패키징-
dc.subject패키징-
dc.subject골드 범프-
dc.subject파인피치범프-
dc.subjectFINE PITCH BUMP-
dc.subjectBONDING-
dc.subject3D PACKAGING-
dc.subjectPACKAGING-
dc.subjectAU BUMP-
dc.title전해도금을 이용한 미세 피치 Au bump 제조 방법 및 접합에 관한 연구 = Fabrication and bonding of fine pitch Au bump by electroplating-
dc.typeThesis(Master)-
dc.identifier.CNRN238338/325007 -
dc.description.department한국과학기술원 : 신소재공학과, -
dc.identifier.uid020023632-
dc.contributor.localauthor최준식-
dc.contributor.localauthorChoi, Joon-Sik-
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MS-Theses_Master(석사논문)
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