학위논문(석사) - 한국과학기술원 : 재료공학과, 1998.2, [ iv, 83 p. ]
공정 납/주석; 금속간 화합물; 전해도금; 플립칩; 솔더범프; Eutectic Pb/Sn; IMC(Intermetallic Compound); Electroplating; UBM(Under Bump Metallurgy); Flip chip
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