학위논문(박사) - 한국과학기술원 : 재료공학과, 2001, [ xv, 164 p. ]
고주파 특성; 열사이클 신뢰성; 이방성 전도 접착제/필름; 전자 패키징; Flip Chip Technology; High Frequency Property; Thermal Cycling Reliability; Anisotropic Conductive Adhesive/Film; Electronic Packaging; 플립 칩 기술
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