전자패키징용 복합 솔더에서 Cu/Ni 비율에 따른 금속간 화합물의 형성과 특성 평가에 관한 연구 = A Study of the effect of the Cu/Ni ratio on formation of intermetallic compounds and evaluation of reliability in the Cu-Ni-bearing composite solders

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Advisors
이혁모researcherLee, Hyuck-Moresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2006
Identifier
258119/325007  / 020015860
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2006.8, [ 134 p. ]

Keywords

lead free composite solder; 무연 복합 솔더

URI
http://hdl.handle.net/10203/49683
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=258119&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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