전자패키징용 복합 솔더에서 Cu/Ni 비율에 따른 금속간 화합물의 형성과 특성 평가에 관한 연구A Study of the effect of the Cu/Ni ratio on formation of intermetallic compounds and evaluation of reliability in the Cu-Ni-bearing composite solders
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이혁모 | - |
| dc.contributor.advisor | Lee, Hyuck-Mo | - |
| dc.contributor.author | 이주원 | - |
| dc.contributor.author | Lee, Joo-Won | - |
| dc.date.accessioned | 2011-12-15 | - |
| dc.date.available | 2011-12-15 | - |
| dc.date.issued | 2006 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=258119&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/49683 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2006.8, [ 134 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | lead free composite solder | - |
| dc.subject | 무연 복합 솔더 | - |
| dc.title | 전자패키징용 복합 솔더에서 Cu/Ni 비율에 따른 금속간 화합물의 형성과 특성 평가에 관한 연구 | - |
| dc.title.alternative | A Study of the effect of the Cu/Ni ratio on formation of intermetallic compounds and evaluation of reliability in the Cu-Ni-bearing composite solders | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 258119/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 020015860 | - |
| dc.contributor.localauthor | 이주원 | - |
| dc.contributor.localauthor | Lee, Joo-Won | - |
- Appears in Collection
- MS-Theses_Ph.D.(박사논문)
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