전자패키지용 Sn-Ag-Cu계 무연 솔더 접합부의 금속간 화합물 성장과 전단강도에 미치는 냉각속도의 영향 = Effect of cooling rate on growth of IMC and shear strength of near eutectic Sn-Ag-Cu solder joint

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Advisors
이혁모researcherLee, Hyuck-Moresearcher
Description
한국과학기술원 : 신소재공학과,
Publisher
한국과학기술원
Issue Date
2004
Identifier
240665/325007  / 000995337
Language
kor
Description

학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xii, 117 p. ]

Keywords

SNAGCU ATION; LEAD-FREE SOLDER; 금속간화합물; 전단강도; 전자패키지계면반응; SHEAR STRENGTHON; 무연솔더; SN-AG-CU; INTERMETALLIC COMPOUND

URI
http://hdl.handle.net/10203/49627
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=240665&flag=dissertation
Appears in Collection
MS-Theses_Ph.D.(박사논문)
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