전자패키지용 Sn-Ag-Cu계 무연 솔더 접합부의 금속간 화합물 성장과 전단강도에 미치는 냉각속도의 영향Effect of cooling rate on growth of IMC and shear strength of near eutectic Sn-Ag-Cu solder joint
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.advisor | 이혁모 | - |
| dc.contributor.advisor | Lee, Hyuck-Mo | - |
| dc.contributor.author | 정상원 | - |
| dc.contributor.author | Jeong, Sang-Won | - |
| dc.date.accessioned | 2011-12-15 | - |
| dc.date.available | 2011-12-15 | - |
| dc.date.issued | 2004 | - |
| dc.identifier.uri | http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=240665&flag=dissertation | - |
| dc.identifier.uri | http://hdl.handle.net/10203/49627 | - |
| dc.description | 학위논문(박사) - 한국과학기술원 : 신소재공학과, 2004.8, [ xii, 117 p. ] | - |
| dc.language | kor | - |
| dc.publisher | 한국과학기술원 | - |
| dc.subject | SNAGCU ATION | - |
| dc.subject | LEAD-FREE SOLDER | - |
| dc.subject | 금속간화합물 | - |
| dc.subject | 전단강도 | - |
| dc.subject | 전자패키지계면반응 | - |
| dc.subject | SHEAR STRENGTHON | - |
| dc.subject | 무연솔더 | - |
| dc.subject | SN-AG-CU | - |
| dc.subject | INTERMETALLIC COMPOUND | - |
| dc.title | 전자패키지용 Sn-Ag-Cu계 무연 솔더 접합부의 금속간 화합물 성장과 전단강도에 미치는 냉각속도의 영향 | - |
| dc.title.alternative | Effect of cooling rate on growth of IMC and shear strength of near eutectic Sn-Ag-Cu solder joint | - |
| dc.type | Thesis(Ph.D) | - |
| dc.identifier.CNRN | 240665/325007 | - |
| dc.description.department | 한국과학기술원 : 신소재공학과, | - |
| dc.identifier.uid | 000995337 | - |
| dc.contributor.localauthor | 정상원 | - |
| dc.contributor.localauthor | Jeong, Sang-Won | - |
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