급속 열처리시 실리콘 웨이퍼에 발생하는 슬립 현상의 해석Analysis of thermal stress-induced slip in silicon wafer during rapid thermal processing

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dc.contributor.advisor엄윤용-
dc.contributor.advisorEarmme, Youn-Young-
dc.contributor.author이혁-
dc.contributor.authorLee, Hyouk-
dc.date.accessioned2011-12-14T07:04:12Z-
dc.date.available2011-12-14T07:04:12Z-
dc.date.issued1990-
dc.identifier.urihttp://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=67479&flag=dissertation-
dc.identifier.urihttp://hdl.handle.net/10203/46940-
dc.description학위논문(석사) - 한국과학기술원 : 기계공학과, 1990.2, [ v, 46 p. ]-
dc.languagekor-
dc.publisher한국과학기술원-
dc.title급속 열처리시 실리콘 웨이퍼에 발생하는 슬립 현상의 해석-
dc.title.alternativeAnalysis of thermal stress-induced slip in silicon wafer during rapid thermal processing-
dc.typeThesis(Master)-
dc.identifier.CNRN67479/325007-
dc.description.department한국과학기술원 : 기계공학과, -
dc.identifier.uid000881386-
dc.contributor.localauthor엄윤용-
dc.contributor.localauthorEarmme, Youn-Young-
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ME-Theses_Master(석사논문)
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