웨이퍼 가공기의 진동 해석 및 실험적 검증Vibration analysis of wafer cutting machine and its experimental verification

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Advisors
이종원researcherLee, Chong-Wonresearcher
Description
한국과학기술원 : 기계공학과,
Publisher
한국과학기술원
Issue Date
1990
Identifier
67447/325007 / 000881049
Language
kor
Description

학위논문(석사) - 한국과학기술원 : 기계공학과, 1990.2, [ v, 66 p. ]

URI
http://hdl.handle.net/10203/46911
Link
http://library.kaist.ac.kr/search/detail/view.do?bibCtrlNo=67447&flag=dissertation
Appears in Collection
ME-Theses_Master(석사논문)
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