온도사이클을 받는 Solder Joint의 피로수명에 관한 연구A study on the fatigue life prediction of Solder Joints under thermal cyclic loading
- Advisors
- 이순복researcher; Lee, Soon-Bokresearcher
- Description
- 한국과학기술원 : 기계공학과,
- Publisher
- 한국과학기술원
- Issue Date
- 1994
- Identifier
- 69213/325007 / 000923125
- Language
- kor
- Description
학위논문(석사) - 한국과학기술원 : 기계공학과, 1994.2, [ iii, 51 p. ]
- Appears in Collection
- ME-Theses_Master(석사논문)
- Files in This Item
- There are no files associated with this item.
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