Showing results 1 to 7 of 7
A 1.9-GHz cmos power amplifier using an interdigitated transmission line transformer Park, Changkun; Baek, Sang-Hyun; Ku, Bon-Hyun; Hong, Songcheol, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.49, no.12, pp.3162 - 3166, 2007-12 |
A new twisted differential line structure on high-speed printed circuit boards to enhance immunity to crosstalk and external noise Kam, DG; Lee, H; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.13, pp.411 - 413, 2003-09 |
Air-Cavity Transmission Lines on Anodized Aluminum for High-Performance RF Modules Yook, Jong-Min; Kim, Kyoung-Min; Kwon, Young Se, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.19, no.10, pp.623 - 625, 2009-10 |
Low-power dynamic termination scheme using NMOS diode clamping Shin, DH; Lee, YM; Kim, KH; Lee, Kwyro, IEEE JOURNAL OF SOLID-STATE CIRCUITS, v.34, no.8, pp.1171 - 1175, 1999-08 |
Monolithic implementation of coaxial line on silicon substrate Jeong, In Ho; Kwon, Young-Se, IEEE MICROWAVE AND GUIDED WAVE LETTERS, v.10, no.10, pp.406 - 408, 2000-10 |
Tournament-shaped magnetically coupled power-combiner architecture for RF CMOS power amplifier Park, Changkun; Lee, Dong Ho; Han, Jeonghu; Hong, Songcheol, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.55, no.10, pp.2034 - 2042, 2007-10 |
Twisted differential line structure on high-speed printed circuit boards to reduce crosstalk and radiated emission Kam D.G.; Lee H.; Kim, Joungho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.27, no.4, pp.590 - 596, 2004-11 |
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