Showing results 1 to 7 of 7
Analytical calculation of radiated emissions from rectangular power bus using embedded capacitor in high-speed packages and PCBs Jeong, Y; Kim, Joungho; Kwon, JH, MICROWAVE AND OPTICAL TECHNOLOGY LETTERS, v.48, pp.358 - 361, 2006-02 |
Chip-Package Hierarchical Power Distribution Network Modeling and Analysis Based on a Segmentation Method Kim, Jae-Min; Lee, Woo-Jin; Shim, Yu-Jeong; Shim, Jong-Joo; Kim, Ki-Yeong; Pak, Jun-So; Kim, Joung-Ho, IEEE TRANSACTIONS ON ADVANCED PACKAGING, v.33, no.3, pp.647 - 659, 2010-08 |
Hybrid analytical Modeling method for split power bus in multilayered package Jeong, Y; Lu, ACW; Wai, LL; Fan, W; Lok, BK; Park, H; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.48, pp.82 - 94, 2006-02 |
Hybrid analytical modeling of noise coupling to signal traces in a power bus with embedded film capacitor Kim, Joungho; Jeong, Y, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.534 - 536, 2006-10 |
Interposer Power Distribution Network (PDN) Modeling Using a Segmentation Method for 3-D ICs With TSVs Kim, Kiyeong; Yook, Jong Min; Kim, Junchul; Kim, Heegon; Lee, Junho; Park, Kunwoo; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.3, no.11, pp.1891 - 1906, 2013-11 |
Matrix substitution method for power bus analysis with isolated power island in high-speed packages and PCBs Jeong, Y; Kim, Joungho, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.16, pp.31 - 33, 2006-01 |
Segmentation method based modeling and analysis of a glass package power distribution network (PDN) Kim, Youngwoo; Fujimoto, Daisuke; Kaji, Shugo; Wada, Shinpei; Park, Hyunwook; Lho, Daehwan; Kim, Joungho; et al, IEICE NONLINEAR THEORY AND ITS APPLICATIONS, v.11, no.2, pp.170 - 188, 2020-04 |
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