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A highly bendable thin film encapsulation by the modulation of thermally induced interfacial residual stress Park, Yong Cheon; Kim, Taehyun; Shim, Hye Rin; Choi, YoungWoo; Hong, Seungbum; Yoo, Seunghyup; Im, Sung Gap, APPLIED SURFACE SCIENCE, v.598, 2022-10 |
A modulus-engineered multi-layer polymer film with mechanical robustness for the application to highly deformable substrate platform in stretchable electronics Kim, Youson; Kim, Junmo; kim, chanyoung; Kim, Taehyun; Lee, Chungryeol; Jeong, Kihoon; Jo, Woosung; et al, CHEMICAL ENGINEERING JOURNAL, v.431, no.2, 2022-03 |
Organic–Inorganic Hybrid Approach to Pulse Oximetry Sensors with Reliability and Low Power Consumption Lee, Hyeonwoo; Lee, Woochan; Lee, Hyunwoo; Kim, Sungyeon; Alban, Marco Vinicio; Song, Jinouk; Kim, Taehyun; et al, ACS Photonics, v.8, no.12, pp.3564 - 3572, 2021-11 |
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