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Showing results 1 to 13 of 13

1
30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Jung, Daniel Hyunsuk; Kim, Hee-Gon; Kim, Suk Jin; Kim, Jonghoon J.; Bae, Bumhee; Kim, Jonghoon; Yook, Jong-Min; et al, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.11, pp.814 - 816, 2014-11

2
Algorithm for Extracting Parameters of the Coupling Capacitance Hysteresis Cycle for TSV Transient Modeling and Robustness Analysis

Piersanti, Stefano; Pellegrino, Enza; de Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Dong-Hyun; Kim, Joungho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1329 - 1338, 2017-08

3
An Efficient Crosstalk-Included Eye-Diagram Estimation Method for High-Speed Interposer Channel on 2.5-D and 3-D IC

Choi, Sumin; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.3, pp.927 - 939, 2017-06

4
An Investigation of Electromagnetic Radiated Emission and Interference From Multi-Coil Wireless Power Transfer Systems Using Resonant Magnetic Field Coupling

Kong, Sunkyu; Bae, Bumhee; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kim, Suk Jin; Song, Chiuk; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.63, no.3, pp.833 - 846, 2015-03

5
Chip-Level Simultaneous Switching Current Measurement in Power Distribution Network Using Magnetically Coupled Embedded Current Probing Structure

Kim, Jonghoon J.; Cho, Changhyun; Bae, Bumhee; Kim, Suk Jin; Kong, Sunkyu; Kim, Hee-Gon; Jung, Daniel Hyunsuk; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.12, pp.1963 - 1972, 2014-12

6
Coil Design and Measurements of Automotive Magnetic Resonant Wireless Charging System for High-Efficiency and Low Magnetic Field Leakage

Kim, Hongseok; Song, Chiuk; Jung, Daniel Hyunsuk; Kim, DongHyun; Kim, In Myoung; Kim, Young Il; Kim, Jong Hoon; et al, IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, v.64, no.2, pp.383 - 400, 2016-02

7
High-Efficiency PCB- and Package-Level Wireless Power Transfer Interconnection Scheme Using Magnetic Field Resonance Coupling

Kim, Sukjin; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Bae, Bumhee; Kong, Sunkyu; Ahn, Seungyoung; Kim, Jonghoon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.7, pp.863 - 878, 2015-07

8
High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs

Lee, Man Ho; Jung, Daniel Hyunsuk; Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.33, no.2, pp.17 - 29, 2016-03

9
Localization of Short and Open Defects in Multilayer Through Silicon Vias (TSV) Daisy-Chain Structures

Piersanti, Stefano; de Paulis, Francesco; Olivieri, Carlo; Jung, Daniel Hyunsuk; Kim, Joungho; Orlandi, Antonio, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.5, pp.1558 - 1564, 2017-10

10
Low EMF and EMI Design of a Tightly Coupled Handheld Resonant Magnetic Field (HH-RMF) Charger for Automotive Battery Charging

Song, Chiuk; Kim, Hongseok; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Kong, Sunkyu; Kim, Jiseong; Ahn, Seungyoung; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.58, no.4, pp.1194 - 1206, 2016-08

11
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC

Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12

12
Signal Integrity Design and Analysis of a Multilayer Test Interposer for LPDDR4 Memory Test With Silicone Rubber-Based Sheet Contact

Kim, Jonghoon J.; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Kim, Youngwoo; Park, Junyong; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.59, no.4, pp.1239 - 1251, 2017-08

13
Through Silicon Via (TSV) Defect Modeling, Measurement, and Analysis

Jung, Daniel Hyunsuk; Kim, Youngwoo; Kim, Jonghoon J.; Kim, Heegon; Choi, Sumin; Song, Yoon-Ho; Bae, Hyun-Cheol; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.1, pp.138 - 152, 2017-01

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