30 Gbps High-Speed Characterization and Channel Performance of Coaxial Through Silicon Via

Cited 27 time in webofscience Cited 30 time in scopus
  • Hit : 552
  • Download : 0
Coaxial through silicon via (TSV) technique allows reduction of high frequency loss due to conductivity in silicon substrate and flexibility in impedance by controlling the ratio of shield to center radii. For the first time, we measured and analyzed the high-speed channel performance of coaxial TSV. This letter presents the measurement results of the fabricated test vehicle in S-parameter and eye-diagram. The eye-diagram measurement results prove that coaxial TSV is capable of supporting signal transmission up to bit rate of 30 Gbps. The equivalent circuit model is suggested and experimentally verified by S-parameter comparison. Furthermore, the superiority of coaxial TSV over conventional TSV is confirmed by comparison of S-parameter results from equivalent circuit model simulation.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2014-11
Language
English
Article Type
Article
Keywords

TSV

Citation

IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.24, no.11, pp.814 - 816

ISSN
1531-1309
DOI
10.1109/LMWC.2014.2348502
URI
http://hdl.handle.net/10203/193906
Appears in Collection
EE-Journal Papers(저널논문)
Files in This Item
There are no files associated with this item.
This item is cited by other documents in WoS
⊙ Detail Information in WoSⓡ Click to see webofscience_button
⊙ Cited 27 items in WoS Click to see citing articles in records_button

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0