Showing results 3 to 6 of 6
Epitaxial Lift-Off Technology for Large Size III-V-on-Insulator Substrate Lee, Subin; Kim, Seongkwang; Han, Jae-Hoon; Song, Jin Dong; Jun, Dong-Hwan; Kim, Sang-Hyeon, IEEE ELECTRON DEVICE LETTERS, v.40, no.11, pp.1732 - 1735, 2019-11 |
Large-Scale Terahertz Sensor Array Module With Antenna-Coupled Microbolometers on Glass Substrate With Sigma-Delta ADC Readout ASIC Hong, John; Andrews, Sean; Bos, Jan; Chan, Edward; Chang, Tallis; Condito, Vincent; Lewis, Alan; et al, IEEE TRANSACTIONS ON TERAHERTZ SCIENCE AND TECHNOLOGY, v.13, no.3, pp.200 - 208, 2023-05 |
Measurement and Analysis of Through Glass Via Noise Coupling and Shielding Structures in a Glass Interposer Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Hwang, Insu; Kim, Jihye; Son, Kyungjune; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.63, no.5, pp.1562 - 1573, 2021-10 |
Signal Integrity Design and Analysis of Silicon Interposer for GPU-Memory Channels in High-Bandwidth Memory Interface Cho, Kyungjun; Kim, Youngwoo; Lee, Hyunsuk; Kim, Heegon; Choi, Sumin; Song, Jinwook; Kim, Subin; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.9, pp.1658 - 1671, 2018-09 |
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