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Results 1-10 of 20 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Electrical Performance Analysis of Low-Cost and Ultra-Thin Glass Interposer: Advantages, Challenges and Solutions Kim, Joungho; Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Park, Shinyoung; Ahn, Seungyoung, DesignCon 2018, DesignCon 2018, 2018-01-31 | |
| How to Manage TDMA Power Amplifier Switching Noise Coupling to Audio CODECs in Mobile Phones Kim, Joungho; Park, Shinyoung; Song, Jinwook; Kim, Subin; Kim, Youngwoo, DesignCon 2018, DesignCon 2018, 2018-01-31 | |
| Modeling of Through-silicon Via (TSV) with an hmbedded High-density Metal-insulator-metal (MIM) Capacitor Cho, Kyunjun; Kim, Youngwoo; Kim, Subin; Park, Gapyeol; Son, Kyungjune; Park, Hyunwook; Kim, Seongguk; Choi, Sumin; Kim, Dong-Hyun; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 | |
| Statistical Eye-Diagram Estimation Method for High Speed Channel with N-Tap Decision Feedback Equalizer (DFE) Park, Junyong; Song, Huijin; Kim, Dong-Hyun; Choi, Sumin; Kim, Joungho, Joint 60th IEEE International Symposium on Electromagnetic Compatibility (EMC) / IEEE Asia-Pacific Symposium on Electromagnetic Compatibility (APEMC), pp.1027 - 1032, IEEE, 2018-05 | |
| Study of Series-series Topology for Suppressing Electromagnetic Interference (EMI) for Digital TV Wireless Power Transfer (WPT) Systems Das, Mumpy; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Hong, Seokwoo; Kim, Youngwoo; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), IEEE, 2018-12 | |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 | |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; Watanabee, Atom; Raj, Pulugurtha Markondeya; Sundaram, Venky; Tummala, Rao, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 | |
| Electrical Performance Analysis of Glass Interposer Channel and Power Distribution Network Kim, Youngwoo; Cho, Kyungjun; Park, Gapyeol; Jeong, Seungtaek; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.3 - 5, IEEE, 2018-10-15 | |
| Eye-width and Eye-height Estimation Method based on Artificial Neural Network (ANN) for USB 3.0 Lho, Daehwan; Park, Junyong; Park, Hyunwook; Kang, Hyungmin; Park, Shinyoung; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.209 - 211, IEEE, 2018-10-15 | |
| Reinforcement Learning-based Optimal On-board Decoupling Capacitor Design Method Park, Hyunwook; Park, Junyong; Kim, Subin; Lho, Daehwan; Park, Shinyoung; Park, Gapyeol; Cho, Kyungjun; Kim, Joungho, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.213 - 215, IEEE, 2018-10-15 |
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