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Results 1-10 of 38 (Search time: 0.005 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11 | |
| Design of a Mobile AP GPU PDN based on Chip Power Model and Measurement Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Analysis of Shifting in Self-Resonance Frequency of Flexible Coil for Wireless Power Transfer Jeong, Seungtaek; Kim, Joungho; Song, Jinwook; Kim, Hongseok; Song, Chiuk; Kim, SukJin; Lee, Seongsoo, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-20 | |
| Reduction Mehod of Electromagnetic Interference in Tightly-Coupled Resonant Magnetic Field Automotive Charger with Input Impedance Design Kim, Joungho; Yoon, Kibum; Son, Chiuk; Kim, Hongseok; Cho, Yeonje; Seungtaek, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-06 | |
| Hybrid Metamaterial Design for Magnetic Field Shielding in Wireless Power Transfer Lee, Seongsoo; Kim, Joungho; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Cho, Yeonje; Jeon, Seungtaek, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-20 | |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; Bae, Michael, DesignCon 2016, DesignCon 2016, 2016-01-19 | |
| Analysis on Via Design for Impedance Mismatch Minimization in High Speed Channel Lim, Jaemin; Kim, Joungho; Kim, Heegon; Kim, Dong-Hyun; Jeon, Yeseul; Koh, Wee Jin; Chang Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| EMI Reduction Method of Three Phase WPT Charger for Drone with Duty Control of Vsi Song, Chiuk; Kim, Joungho; Kim, Hongseok; Yoon, Kibum; Cho, Yeonje; Lee, Seongsoo; Jeong, Seungtaek; Jo, Kyoungyoung; Kim, Youngbeom; Moon, Heechang, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-21 | |
| Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; Choi, Kwang-Seong, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
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