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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Electromagnetic Interference Reduction Method from Handheld Resonant Magnetic Field Charger (HH-RMFC) for Electric Vehicle Kim, Joungho; Song, Chiuk; Jeong, Hyunseok; Song, Eun Seok; Cho, Yeon Jea; Kim, Sukjin; Kim, Jong Hun, IEEE Wireless Power Transfer Conference 2014 (WPTC 2014), IEEE Wireless Power Transfer Conference 2014, 2014-11-02 | |
| Electromagnetic Radiated Emissions from a Repeating-Coil Wireless Power Transfer System using a Resonant Magnetic Field Coupling Kim, Joungho; Kong, Sunkyu; Bae, Bumhee; Kim, Jong Hun; Kim, Sukjin; Jeong, Hyunseok, IEEE Wireless Power Transfer Conference 2014 (WPTC 2014), IEEE Wireless Power Transfer Conference 2014, 2014-11-02 | |
| Analysis and Optimization of a Power Distribution Network in 2.5D IC with Glass Interposer Kim, Joungho; Jonghyun Cho; Kiyeong Kim; Heegon Kim; Srikrishna Sitaraman; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 | |
| Magnetically-Coupled Current Probing Structure Consisting of TSVs and RDLs in 2.5D and 3D Ics Kim, Joungho; Bumhee Bae; Sukjin Kim; Sunkyu Kong; Heegon Kim; Daniel H. Jung, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 | |
| Fault Detection and Isolation of Multiple Defects in Through Silicon Via (TSV) Channel Kim, Joungho; Heegon Kim; Jonghoon J; Sukjin Kim; Hyun-Cheol Bae; Kwang-Seong Cho, IEEE International 3D Systems Integration Conference, IEEE International 3D Systems Integration Conference, 2014-12-01 | |
| Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC Kim, Joungho, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2014-12-15 | |
| Coaxial through-package-vias (TPVs) for enhancing power integrity in 3D double-side glass interposers Kumar, Gokul; Raj, P. Markondeya; Cho, Jounghyun; Gandhi, Saumya; Chakraborti, Parthasarathi; Sundaram, Venky; Kim, Joungho; Tummala, Rao, 64th Electronic Components and Technology Conference, ECTC 2014, pp.541 - 547, Institute of Electrical and Electronics Engineers Inc., 2014-05 | |
| Electromagnetic interference and radiation from wireless power transfer systems Kim, Jonghoon; Kim, Hongseok; Song, Chiuk; Kim, In-Myoung; Kim, Young-Il; Kim, Joungho, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.171 - 176, Institute of Electrical and Electronics Engineers Inc., 2014-08 | |
| Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer Lee, Hyunsuk; Kim, Hee-Gon; Kim, Kiyeong; Jung, Daniel Hyunsuk; Kim, Jonghoon J; Choi, Sumin; Lim, Jaemin; Kim, Joungho; Kim, Hyungsoo; Park, Kunwoo, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.850 - 854, Institute of Electrical and Electronics Engineers Inc., 2014-08 |
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