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Results 1-10 of 22 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Effect of ground guard fence with via and ground slot on radiated emission in multi-layer digital printed circuit board Lee, H.; Kim, J.; Ahn, S.; Byun, J.-G.; Kang, D.-S.; Choi, C.-S.; Hwang, H.-J.; Kim, Joungho, 2001 IEEE International Symposium on Electromagnetic Compatibility, v.1, pp.653 - 656, IEEE, 2001-08-13 | |
| GHz twisted differential line structure on printed circuit board to minimize EMI and crosstalk noises Kam, D.G.; Lee, H.; Baek, S.; Park, B.; Kim, Joungho, 52nd Electronic Components and Technology Conference, pp.1058 - 1065, 2002-05-28 | |
| Effect of power/ground partitioning and stitching capacitor placement on signal integrity and emi of multi-layer and multi power system Kim, Joungho; Kim, H.; Lee, H.; Kim, J.; Kim, J., Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition, v.1, pp.59 - 62, 2001-07-08 | |
| An evaluation of differential impedance in PCBs using two single-ended probes only Kam, D.G.; Lee, H.; Ryu, W.; Kim, J.; Park, B.; Kim, Joungho, 6th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.169 - 171, IEEE, 2002-05-12 | |
| Analysis of power delivery network constructed by irregular-shaped power/ground plane including densely populated via-hole Lee, H.; Hong, Y.-S.; Kam, D.; Kim, Joungho, Proceedings - 8th IEEE Workshop on Signal Propagation on Interconnects, pp.31 - 34, 2004-05-09 | |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 | |
| Impact of partial EBG PDN on PI, SI and lumped model-based correlation Lee, J.; Lee, H.; Park, K.; Chung, B.; Kim, J.; Kim, Joungho, 2008 Asia-Pacific Symposium on Electromagnetic Compatibility and 19th International Zurich Symposium on Electromagnetic Compatibility, APEMC 2008, pp.168 - 171, 2008-05-19 | |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 | |
| A dual-slope signaling scheme to suppress electromagnetic interference (EMI) with sustaining eye margin Yoon, C.; Baek, S.; Lee, H.; Jeong, Y.; Park, J.; Park, H.; Sung, B.; Kim, Joungho, 17th Conference on Electrical Performance of Electronic Packaging, EPEP 2008, pp.143 - 146, 2008-10-27 | |
| Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |