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Results 361-370 of 526 (Search time: 0.004 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Hybrid Metamaterial with Zero and Negative Permeability to Enhance Efficiency in Wireless Power Transfer System Kim, Joungho; Lee, Seongsoo; Jeong, Seungtaek; Kim, Hongseok; Song, Chiuk; Yoon, Kibum; Song, Jinwook; Kong, Sunkyu; Yun, Yeojin, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 | |
| Eye-diagram Estimation and Analysis of High-Bandwidth Memory (HBM) Interposer Channel with Crosstalk Reduction Schemes on 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Eye Diagram Estimation of 8B/10B Encoded Highspeed Serial Link for Signal Integrity Test using Silicone Rubber Socket Park, Junyong; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Bae, Michael; Ha, Dongho, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Mobile AP GPU Power Distribution Network Simulation and Analysis based on Chip Power Model Kim, Youngwoo; Kim, Joungho; Kim, Heegon; Cho, Jonghyun; Kang, Kibum; Yang, Taisik; Paik, Woohyun, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Electromagnetic Interference on Analog-to-Digital Converters from High-Power Wireless Power Transfer System for Automotive Charger Kong, Sunkyu; Kim, Joungho; Bae, Bumhee; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk, IEEE International Conference on Electromagnetic Compatibility (EMC 2016), IEEE International Conference on Electromagnetic Compatibility (EMC 2016), 2016-07-27 | |
| Statistical Analysis of Simultaneous Switching Output (SSO) Impacts on Steady State Output Responses and Signal Integrity Kim, Youngwoo; Fujimoto, Daisuke; Nishiyama, Hikaru; Hayashi, Yu-Ichi; Lho, Daehwan; Park, Hyunwook; Kim, Joungho, 12th International Workshop on the Electromagnetic Compatibility of Integrated Circuits, EMC COMPO 2019, pp.138 - 140, Institute of Electrical and Electronics Engineers Inc., 2019-10 | |
| Design of the PCB embedded active IC structure for ultra-thin wearable application with low-RFI Bae, Bumhee; Shim, JongWan; Kim, Younho; Kim, HyungGeun; Park, HarkByeong; Kim, Joungho, 2017 Asia-Pacific International Symposium on Electromagnetic Compatibility, APEMC 2017, pp.325 - 327, Institute of Electrical and Electronics Engineers Inc., 2017-06 | |
| Modeling of hierarchical power/ground network based on segmentation method for package/board co-design and simulation Kim, J.; Jeong, Y.; Kim, J.; Lee, J.; Shim, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.16 - 19, IEEE, 2006-08-14 | |
| Modeling and experimental verification to investigate the effect of power supply noise imbalance on 900MHz differential LNA Koo, K.; Shim, J.; Shim, Y.; Kim, Joungho, 12th IEEE Workshop on Signal Propagation on Interconnects, SPI, pp.343 - 346, IEEE, 2008-05-12 | |
| Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26 |
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