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Results 31-38 of 38 (Search time: 0.008 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Electromagnetic Interference on Analog-to-Digital Converters from High-Power Wireless Power Transfer System for Automotive Charger Kong, Sunkyu; Kim, Joungho; Bae, Bumhee; Kim, Dong-Hyun; Kim, Hongseok; Song, Chiuk, IEEE International Conference on Electromagnetic Compatibility (EMC 2016), IEEE International Conference on Electromagnetic Compatibility (EMC 2016), 2016-07-27 | |
| Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC Choi, Sumin; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Lee, Hyunsuk; Cho, Kyungjun, 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05-08 | |
| Reduction method of electromagnetic interference in tightly-coupled resonant magnetic field automotive charger with input impedance design Yoon, Kibum; Song, Chiuk; Kim, Hongseok; Cho, Yeonje; Jeong, Seungtaek; Kim, Joungho, 2016 IEEE Wireless Power Transfer Conference, WPTC 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05 | |
| Multi-layer Probe Card Design with Signal/Power Integrity for Wafer-level AP Test in LPDDR4 Channel Song, Jinwook; Kim, Joungho; Lee, Eunjung; Kim, Jonghoon; Park, Shinyoung; Park, Jeoung Keun; Park, Jong Hyun; Yoon, Hee Bang; Kim, Il; Nam, Seungki, IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.547 - 552, Institute of Electrical and Electronics Engineers Inc., 2016-07-27 | |
| Highly-Effective Integrated EMI Shields with Graphene and Nanomagnetic Multilayered Composites Watanabe, Atom O; Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Min, Junki; Wong, Denny; Pulugurtha, Markondeya R.; Mullapudi, Ravi; Kim, Joungho; Tummala, Rao R., 66th IEEE Electronic Components and Technology Conference, ECTC 2016, pp.206 - 210, Institute of Electrical and Electronics Engineers Inc., 2016-05 | |
| Extraction of the parameters of the coupling capacitance hysteresis cycle for TSV transient modeling Piersanti, S; Pellegrino, E; De Paulis, F; Orlandi, A; Kim, Joungho; Fan, Jun, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.406 - 411, Institute of Electrical and Electronics Engineers Inc., 2016-07 | |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; Kim, Jiseong, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27 | |
| Signal and power integrity design of 2.5D HBM (High bandwidth memory module) on SI interposer Cho, Kyungjun; Lee, Hyunsuk; Kim, Joungho, Pan Pacific Microelectronics Symposium, Pan Pacific 2016, Institute of Electrical and Electronics Engineers Inc., 2016-01 |
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