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Results 11-20 of 38 (Search time: 0.007 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Low EMI Three Phase Wireless Charger for Drone with 150 Degree Conduction Mode of VSI Song, Chiuk; Kim, Joungho; Kim, Hongseok; Cho, Yeonje; Jo, Kyoungyoung; Kim, Youngbeom; Moon, Heechang, 2016 IEEE International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES), 2016 IEEE International Conference on Wireless Information Technology and Systems (ICWITS) and Applied Computational Electromagnetics (ACES), 2016-03-17 | |
| High-frequency modeling and signal integrity analysis of high-density silicone rubber socket Kim, Hyesoo; Park, Junyong; Park, Shinyoung; Kim, Jonghoon J; Kim, Joungho; Ha, Dongho; Bae, Michael; Shin, Jongcheon, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.55 - 57, Institute of Electrical and Electronics Engineers Inc., 2016-12 | |
| Signal integrity analysis of vertical dual port coaxial connector for automotive system Kim, Dong-Hyun; Lee, Hyunsuk; Kim, Hongseok; Kim, Jonghoon; Kim, Joungho; Park, Jung-Min; Kim, Ji-Min; Lee, Kyung-Nam; Woo, Jong-Hoon; Kwon, Hyeok-Cheol; Kim, Hoon, 25th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2016, pp.165 - 167, Institute of Electrical and Electronics Engineers Inc., 2016-10 | |
| Power Distribution Network (PDN) Design and Analysis of A Single and. Double-Sided High Bandwidth Memory (HBM) Interposer for 2.5D Terabtye/s Bandwidth System Cho, Kyungjun; Kim, Joungho; Kim, Youngwoo; Kim, Subin; Lee, Hyunsuk; Choi, Sumin; Kim, Heegon, IEEE International Conference on Signal and Power Integrity (SIPI 2016), IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 | |
| Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC Lee, Hyunsuk; Kim, Joungho; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 | |
| PCB-package to Chip Wireless Power Transfer Scheme using Magnetic-field Resonance Coupling for High-density 3-D IC Song, Jinwook; Kim, Joungho; Jeong, Seungtaek; Park, Shinyoung; Kim, Jonghoon; Cho, Yeonje, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 | |
| Power/ground noise coupling comparison and analysis in silicon, organic and glass interposers Kim, Youngwoo; Cho, Kyungjun; Kim, Subin; Park, Gapyeol; Kim, Joungho, 2016 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.11 - 13, Institute of Electrical and Electronics Engineers Inc., 2016-12 | |
| Audio frequency ground integrity modeling and measurement for a TDMA smartphone system Park, Shinyoung; Song, Jinwook; Kim, Subin; Lee, Man Ho; Kim, Jonghoon; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2016, pp.3 - 5, Institute of Electrical and Electronics Engineers Inc., 2016-12 | |
| Low EMF Three Phase Resonant Magnetic Field Charger for Drone with High Q Reactive Loop Shielding Kim, Joungho; Song, Chiuk; Kim, Hongseok; Kong, Sunkyu; Cho, Yeonje; Yoon, Kibum; Lee, Seongsoo; Kim, n-Myoung; Kim, Young-il, IEEE Wireless Power Transfer Conference 2016, IEEE Wireless Power Transfer Conference 2016, 2016-05-05 | |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 |
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