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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| Analysis on Via Design for Impedance Mismatch Minimization in High Speed Channel Lim, Jaemin; Kim, Joungho; Kim, Heegon; Kim, Dong-Hyun; Jeon, Yeseul; Koh, Wee Jin; Chang Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| Analysis of Vertical PCB Connector Induced Via Stub Reduction in High Speed Serial Link Kim, Dong-Hyun; Kim, Joungho; Kim, Heegon; Lim, Jaemin; Jeon, Yeseul; Koh, Wee Jin; Chang, Weng Yew Richard, Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), Asia-Pacific International Symposium on Electromagnetic Compatibility & Signal Integrity and Technical Exhibition (APEMC 2016), 2016-05-19 | |
| Signal Integrity of Bump-less High-speed Through Silicon Via Channel for Terabyte/s Bandwidth 2.5D IC Lee, Hyunsuk; Kim, Joungho; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Cho, Kyungjun; Jeon, Yeseul, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-05-31 |
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