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Results 41-50 of 50 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
41
An Induction Heating System Analysis Method based on Operating Conditions

Kang, Hyungmin; Lho, Daehwan; Park, Hyunwook; Kong, Taewoong; Choi, Hyojin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.478 - 481, Institute of Electrical and Electronics Engineers Inc., 2020-07

42
Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity

Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; Park, Gapyeol; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07

43
A deep neural network-based estimation of efficiency enhancement by an intermediate coil in automotive wireless power transfer system

Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Lee, Seongsoo; Jeong, Seung Taek; Kim, Hongseok; Park, Hyunwook; Kang, Hyungmin; Hong, Seokwoo; Kim, Joungho, 2020 IEEE Wireless Power Transfer Conference, WPTC 2020, pp.231 - 233, Institute of Electrical and Electronics Engineers Inc., 2020-11

44
A Deep Neural Network-based Estimation of EMI Reduction by an Intermediate Coil in Automotive Wireless Power Transfer System

Sim, Boogyo; Lho, Daehwan; Park, Dongryul; Park, Hyunwook; Kang, Hyungmin; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.407 - 410, Institute of Electrical and Electronics Engineers Inc., 2020-07

45
Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs

Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; Son, Kyungjune; Park, Gap Yeol; Jeong, Seung Taek; Kim, Joungho, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12

46
Low EMF Design of Cochlear Implant Wireless Power Transfer System using A Shielding Coil

Hong, Seokwoo; Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Kim, Hongseok; Kim, Joungho, 2020 IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.623 - 625, Institute of Electrical and Electronics Engineers Inc., 2020-07

47
Cochlear implant wireless power transfer system design for high efficiency and link gain stability using a proposed stagger tuning method

Hong, Seokwoo; Jeong, Seungtaek; Lee, Seongsoo; Sim, Boogyo; Kim, Hongseok; Lee, Hoseung; Ahn, Woojin; Park, Jonghyeok; Lee, Seunghoom; Kim, Joungho, IEEE Wireless Power Transfer Conference, WPTC 2020, pp.26 - 29, Institute of Electrical and Electronics Engineers Inc., 2020-11

48
Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs

Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26

49
Deterministic Policy Gradient-based Reinforcement Learning for DDR5 Memory Signaling Architecture Optimization considering Signal Integrity

Lho, Daehwan; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, Boogyo; Son, Kyungjune; Son, Keeyoung; Kim, Jihun; Choi, Seonguk; Park, Joonsang; Kim, Haeyeon; Kong, Kyubong; Kim, Joungho, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10

50
A Low EMI Board-to-board Connector Design for 5G mmWave and High-speed Signaling

Kim, Keunwoo; Lee, Junghyun; Hong, Seokwoo; Kim, Hyunwoo; Sim, Boogyo; Son, Kyungjune; Shin, Taein; Son, Keeyoung; Kim, Jinyoung; Kong, Kyubong; Kim, Joungho, 31st IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-10

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