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Results 1-10 of 12 (Search time: 0.005 seconds).

NO Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date)
1
PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization

Kim, Jihun; Kim, Joungho; Park, Hyunwook; Kim, SeongGuk; Choi, Seonguk; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

2
Imitation Learning for Simultaneous Escape Routing

Kim, Minsu; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

3
Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic

Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Park, Joonsang; Kim, Haeyeon; Shin, TaeIn; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

4
Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs

Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; Kang, Hyungmin; Kim, SeongGuk; Shin, TaeIn; Kim, Keunwoo; Son, Keeyoung, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

5
Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation

Park, Joonsang; Kim, Joungho; Kim, SeongGuk; Son, Keeyoung; Shin, TaeIn; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

6
Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port

Kim, Haeyeon; Kim, Joungho; Park, Hyunwook; Choi, Seonguk; Park, Joonsang; Kim, SeongGuk, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

7
Signal Integrity Analysis of High Speed Channel considering Thermal Distribution

Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17

8
Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface

Shin, TaeIn; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Son, Keeyoung; Park, Gap Yeol; Park, Joonsang; Choi, Seonguk, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13

9
Signal Integrity Design and Analysis of a HDMI 2.1 Connector for Improved Electrical Characteristics

Park, Hyunwook; Kim, Joungho; Park, Joonsang; Park, Gap Yeol; Lho, Daehwan; Sim, BooGyo; Kang, Hyungmin; Shin, TaeIn; Kim, SeongGuk; Choi, Seonguk, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13

10
Signal Integrity Design and Analysis of a Spiral Through-Silicon Via (TSV) Array Channel for High Bandwidth Memory (HBM)

Kim, SeongGuk; Kim, Joungho; Shin, TaeIn; Park, Hyunwook; Lho, Daehwan; Son, Keeyoung; Kim, Keunwoo; Park, Joonsang; Choi, Seonguk; Kim, Haeyeon, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13

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