Search
Results 1-10 of 22 (Search time: 0.006 seconds).
| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| A New Challenge for Neuromorphic Computing System: from Off-chip Interconnects to On-chip Interconnects Park, Hyunwook; Kim, Joungho; Kim, SeongGuk; Kim, Keunwoo; Son, Keeyoung, DesignCon 2022, IEEE, 2022-04-05 | |
| Deterministic Policy-based Reinforcement Learning Method for Optimization method Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Sim, BooGyo; Son, Kyungjune; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon, 31st Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2022, IEEE, 2022-10-11 | |
| PAM-4 based PCIe 6.0 Channel Design Optimization Method using Bayesian Optimization Kim, Jihun; Kim, Joungho; Park, Hyunwook; Kim, SeongGuk; Choi, Seonguk; Son, Keeyoung; Park, Joonsang; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Imitation Learning for Simultaneous Escape Routing Kim, Minsu; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Kim, Haeyeon; Song, Jinwook, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Sequential Policy Network-based Optimal Passive Equalizer Design for an Arbitrary Channel of High Bandwidth Memory using Advantage Actor Critic Choi, Seonguk; Kim, Joungho; Park, Hyunwook; Son, Keeyoung; Kim, SeongGuk; Park, Joonsang; Kim, Haeyeon; Shin, TaeIn; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; Kang, Hyungmin; Kim, SeongGuk; Shin, TaeIn; Kim, Keunwoo; Son, Keeyoung, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Deep Reinforcement Learning-based Pin Assignment Optimization of BGA Packages considering Signal Integrity with Graph Representation Park, Joonsang; Kim, Joungho; Kim, SeongGuk; Son, Keeyoung; Shin, TaeIn; Park, Hyunwook; Choi, Seonguk; Kim, Haeyeon; Kim, Keunwoo, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Deep Reinforcement Learning Framework for Optimal Decoupling Capacitor Placement on General PDN with an Arbitrary Probing Port Kim, Haeyeon; Kim, Joungho; Park, Hyunwook; Choi, Seonguk; Park, Joonsang; Kim, SeongGuk, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Signal Integrity Analysis of High Speed Channel considering Thermal Distribution Son, Keeyoung; Kim, Joungho; Kim, SeongGuk; Lho, Daehwan; Kim, Keunwoo; Park, Hyunwook; Park, Gap Yeol, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 | |
| Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface Shin, TaeIn; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Son, Keeyoung; Park, Gap Yeol; Park, Joonsang; Choi, Seonguk, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |