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| NO | Title, Author(s) (Publication Title, Volume Issue, Page, Issue Date) |
|---|---|
| High frequency electrical model of through wafer via for 3-D stacked chip packaging Ryu, C.; Lee, J.; Lee, H.; Lee, K.; Oh, T.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.215 - 220, IEEE, 2006-09-05 | |
| Design of LTCC-based ultra-wideband transmitter SiP using CMOS impulse generator Yoon, C.; Lee, J.; Kim, M.; Park, Y.; Park, H.; Lee, H.; Kim, Joungho, 8th Electronics Packaging Technology Conference, EPTC 2006, pp.85 - 89, IEEE, 2006-12-06 |
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