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Showing results 1 to 3 of 3

1
Anisotropic Conductive Film (ACF) Flip-chip Interconnect in Over GHz RF Clock Distributioin System

Kim, Joungho; Ryu, Woonghwan; Yim, Myung-Jin; Paik, Kyung-Wook, IEEE Adhesive 2000, pp.153 - 158, IEEE, 2000-06

2
Microwave frequency model of flip-chip interconnects using anisotropic conductive film

Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06

3
Over 10 GHz equivalent circuit model of ACF flip-chip interconnect using Ni-filled ball and Au-coated polymer balls

Ahn, Seung Young; Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Kim, Woo Poung; Paik, Kyung-Wook; et al, Proceedings of the 1999 24th IEEE/CPMT International Electronics Manufacturing Technology Symposium (IEMT 1999), pp.421 - 425, 1999-10-18

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