Showing results 1 to 12 of 12
A compact, low-cost, and wide-band passive equalizer design using multi-layer PCB parasitics Song, E.; Kim, J.; Kim, Joungho; Cho, J., 2010 IEEE 19th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2010, pp.165 - 168, IEEE, 2010-10-25 |
A designated clock generation and distribution (DCGD) chip scheme for substrate noise-free 3-D stacked SiP design Lee, W.; Ryu, C.; Cho, J.; Song, E.; Kim, Joungho, 2010 Asia-Pacific Symposium on Electromagnetic Compatibility, APEMC 2010, pp.334 - 337, APEMC 2010, 2010-04-12 |
A fast and precise eye-diagram estimation method for a channel of a pair of differential microstrip lines on PCB with arbitrary terminations Cho, J.; Song, E.; Shim, J.; Shim, Y.; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
A precise analytical eye-diagram estimation method for non-ideal high-speed channels Cho, J.; Song, E.; Shim, J.; Kim, J.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.159 - 162, IEEE, 2009-10-19 |
Active circuit to through silicon via (TSV) noise coupling Cho, J.; Shim, J.; Song, E.; Pak, J.S.; Lee, J.; Lee, H.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.97 - 100, IEEE, 2009-10-19 |
Compensation of undesired channel effects by frequency domain optimization of pre-emphasis filter for over gbps signaling Kim, J.; Lee, J.; Song, E.; Jo, J.; Kim, Joungho, 2006 IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.721 - 726, IEEE, 2006-08-14 |
Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 |
Design of toroidal current probe embedded in multi-layer printed circuit boards for electrostatic discharge(ESD) detection Sung, H.; Song, E.; Kim, M.; Shim, Y.; Kong, S.; Kwon, J.; Kim, Joungho, 2010 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2010, IEEE, 2010-12-07 |
Estimation of data-dependent jitter using single pulse analysis method in high-speed differential signaling Song, E.; Lee, J.; Kim, J.; Kam, D.G.; Ryu, C.; Kim, Joungho, ESTC 2006 - 1st Electronics Systemintegration Technology Conference, pp.741 - 746, IEEE, 2006-09-05 |
Hybrid equalizer design for 12.5 Gbps serial data transmission Song, E.; Cho, J.; Kim, Joungho, 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.53 - 56, 2009-10-19 |
Precise analysis and modeling of far-end crosstalk and far-end crosstalk saturation using mode analysis in coupled microstrip lines Kim, G.; Song, E.; Kim, Ji Seong; Kim, Joungho, 2009 IEEE Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2009, 2009-12-02 |
Through silicon via (TSV) equalizer Kim, Joungho; Song, E.; Cho, J.; Pak, J.S.; Lee, J.; Lee, H.; Kim, J., 2009 IEEE 18th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS '09, pp.13 - 16, 123, 2009-10-19 |
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