Browse "EE-Conference Papers(학술회의논문)" by Author Pak, Jun So
Showing results 1 to 30 of 30
| 3 GHz Wide Frequency Model of Surface Mount Technology (SMT) Ferrite Bead for Power/Ground and I/O Line Noise Simulation of High-speed PCB Kim, Tae Hong; Kim, Hyungsoo; Pak, Jun So; Kim, Joungho, IEEE 7th Workshop on Signal Propagation on Interconnects, pp.181 - 284, IEEE, 2010-11-15 |
| 3GHz Through-Hole Signal Via Model Considering PowedGround Plane Resonance Coupling and Via Neck Effect Pak, Jun So; Kim, Joungho, Electronic Components and Technology Conference, pp.1017 - 1022, 2003-05-27 |
| A 6.4Gbps On-chip Eye Opening Monitor Circuit for Signal Integrity Analysis of High Speed Channel Kim, Joungho; Shin, Mincheol; Shim, Jongjoo; Kim, Jaemin; Pak, Jun So; Hwang, Chulsoon; Yoon, Changwook; et al, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 7, 2008-08 |
| A Compact On-interposer Passive Equalizer for Chip-to-chip High-speed Data Transmission Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Choi, Sumin; Kim, Joungho; Pak, Jun So, 21th Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 |
| A Frequency Clock Distribution Scheme Using Bond-Wire Inductor Kim, Joungho; Lee, Woojin; Pak, Jun So; Pak, Jiwoo; Ryu, Chunghyun; Park, Jongbae, IEEE Electrical Design of Advanced Packaging and Systems Symposium, 2008 |
| Balanced TLM and Coupling Model for Analysis of Power/Ground Resonance, Noise Coupling, and Edge Radiation Kim, Joungho; Pak, Jun So; Lee, Jongbae; Kim, Hyungsoo; Lee, H.J; Choi, C.S, Electromagnetic Compatibility Conference, pp.505 - 508, 2004 |
| Basic Analysis of Signal and Power Integrity of TSV Applications Pak, Jun So; Kim, Heegon; Cho, Jonghyun; Kim, Joohee; Kim, Kiyeong; Kim, Joungho, 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012 Korea-Japan EMT/EMC/BE Joint Conference (KJJC-2012), 2012-05-18 |
| Design and Implementation of On-chip Embedded Current Probe Using Magnetic Field Coupling in Chip to Chip Wireless Power Transfer System Cho, Changhyun; Cho, Jonghyun; Kim, Myunghoi; Kim, Joungho; Pak, Jun So, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012 IEEE MTT-S International Microwave Workshop Series (IMWS) on Innovative Wireless Power Transmission, 2012-05-11 |
| Distributed Multi TSV 3D Clock Distribution Network in TSV-based 3D IC Kim, Kayoung; Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Effects of On-Chip Decoupling Capacitors and Silicon Substrate on Power Distribution Networks in TSV-based 3D-Ics Kim, Kiyong; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Electrical Performance of 3D TSV Channel and 3D Stacked PDN based on Hierarchical Models Pak, Jun So; Kim, Joohee; Cho, Jonghyun; Kim, Heegon; Kim, Joungho, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011 Design, Automation & Test in Europe (DATE) Conference, 2011-03-01 |
| Frequency and Time Domain Measurement of Through-Silicon Via (TSV) Failure Jung, Daniel H; Kim, Joohee; Kim, Heegon; Kim, Jonghoon J; Kim, Joungho; Pak, Jun So, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23 |
| High-frequency Measurements of TSV failures Kim, Joohee; Cho, Jonghyun; Pak, Jun So; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| High-frequency TSV Failure Detection Method with Z parameter Kim, Joohee; Jung, Daniel H; Chok, Jonghyun; Pak, Jun So; Yook, Jong Min; Kim, Jun Chul; Kim, Joungho, IEEE 38th International symposium of Test and Failure Analysis (ISTFA), IEEE, 2012-11 |
| High-Freuquency TSV Failure Analysis Kim, Joohee; Cho, Jonghyun; Jung, Hyunsuk; Pak, Jun So; Yook, Jong-Min; Kim, Joungho; Kim, Jun Chul, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Low frequency electromagnetic field reduction techniques for the On-Line Electric Vehicle (OLEV) Ahn, Seungyoung; Pak, Jun So; Taigon Song; Lee, Hee Jae; Jung-Gun Byun; Deogsoo Kang; Cheol-Seung Choi; et al, 2010 IEEE International Symposium on Electromagnetic Compatibility, EMC 2010, pp.625 - 630, IEEE, 2010-07-25 |
| Multi-Stacking Through-Silicon-Via Effects on Signal Integrity and Power Integrity for Application of 3-Dimensional Stacked-Chip-Package Kim, Joungho; Pak, Jun So; Ryu, Chunghyun, Presented at XXIX General Assembly of International Union of Radio Science (URSIGA 2008), 2008 |
| Nonlinear Effects of TSV and Harmonic Generation Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| PDN Analysis of TSV based Decoupling Capacitor Stacked Chip (DCSC) in 3D-ICs Song, E; Pak, Jun So; Kim Joungho, 2011 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS 2011, 2011-09-01 |
| Power/ground Noise Immunity Test in Wireless and High-speed UWB Communication System Kim, Joungho; Yoon, Changwook; Park, Hyunjeong; Lee, Woojin; Shin, Minchul; Pak, Jun So, IEEE Electromagnetic Compatibility Symposium, EMC, pp.1 - 6, 123, 2007-12 |
| Prediction and Verification of Power/Ground Plane Edge Radiation Excited by Through-Hole Signal Via Based on Balanced TLM and Via Coupling Model Pak, Jun So; Lee, Junwoo; Kim, Hyungsoo; Kim, Joungho, IEEE 12th Topical Meeting on Electrical Performance of Electronic Packaging, pp.181 - 184, IEEE, 2003-10-27 |
| Radiated Electromagnetic Interference (EMI) Suppression from Plasma Display Panel by using Filtering Method based on Measurements Kim, Joungho; Lee, Heejae; Pak, Jun So; Shin, Minchul; Park, Hyunjeong; Shim, Jongjoo; Kim, Gawon; et al, 2009 Korea-Japan Joint Conference, pp.223 - 226, 2009 |
| Slots on Ground Fillings of Multi-layer Printed Circuit Board for Suppressing Indirect Crosstalk between Digital Clock Line and RF Signal Line in Mixed Mode Mobile Systems Pak, Jun So; Hong, Frank; Kim, Austin; Kim, Joungho; Kim, Gawon, Presented at Proceeding of 2008 IEEE EMC Symposium, pp.1 - 6, IEEE, 2008-10-14 |
| Slow wave and dielectric quasi-TEM modes of metal-insulator-semiconductor (MIS) structure through silicon via (TSV) in signal propagation and power delivery in 3D chip package Pak, Jun So; Cho, J.; Kim, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 60th Electronic Components and Technology Conference, ECTC 2010, pp.667 - 672, ECTC 2010, 2010-06-01 |
| Temperature-Dependent Through-Silicon Via (TSV) Model and Noise Coupling Lee, Manho; Cho,Jonghyun; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| Thermal Effects on Through-Silicon-Via (TSV) Signal Integrity Lee, Manho; Cho, Jonghyun; Pak, Jun So; Lee, Hyungdong; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Through-Silicon Via (TSV) Depletion Effect Cho, Jonghyun; Kim, Myunghoi; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; et al, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24 |
| TSV-based Decoupling Capacitor Schemes in 3D-IC Song, Eunseok; Pak, Jun So; Kim, Joungho, 62nd Electronic Components and Technology Conference (ECTC), 62nd Electronic Components and Technology Conference (ECTC), 2012-05-29 |
| Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC Kim, Dayoung; Kim, Joohee; Pak, Jun So; Kim, Joungho; Lee, Hyungdong; Lee, Junho; Pak, Kunwoo, Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC, Vertical Tree 3-dimensional TSV Clock Distribution Network in 3D IC, 2012-05-29 |
| Via: A Source of Simultaneous Switching Noise Generation, Coupling, and Edge Radiation in High-speed Multi-layer Digital PCB Kim, Joungho; Park, Jongbae; Pak, Jun So; Kim, Hyungsoo, 2004 Korea-Japan Joint Conference on AP/EMC/EMT (KJJC), pp.22 - 23, 2004-11 |
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