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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Effects of On-Chip Decoupling Capacitors and Silicon Substrate on Power Distribution Networks in TSV-based 3D-Ics

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Kim, Kiyong / Pak, Jun So / Lee, Hyungdong / Kim, Jounghoresearcher
Publisher
62nd Electronic Components and Technology Conference (ECTC)
Issue Date
2012-05-29
Language
English
Citation

62nd Electronic Components and Technology Conference (ECTC)

URI
http://hdl.handle.net/10203/170324
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EE-Conference Papers(학술회의논문)
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