Browse "EE-Conference Papers(학술회의논문)" by Author Koo, Kyoungchoul

Showing results 1 to 8 of 8

1
Decoupling capacitor stacked chip (DCSC) in TSV-based 3D-ICs

Song, Eunseok; Koo, Kyoungchoul; Kim, Myunghoi; Park, Jun So; Kim Joungho, 20th Conference on Electrical Performance of Electronic Packaging and Systems, EPEP 2011, 2011-10-24

2
Estimation of Vertical Noise Coupling on 900MHz Low Noise Amplifier from 200MHz On-chip Switching-mode Power Supply in 3D-IC

Koo, Kyoungchoul; Kim, Myunghoi; Lee, Sangrok; Kim, Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17

3
Graphene-based EMI Shielding for Vertical Noise Coupling Reduction in 3D Mixed-Signal System_revised

Kim, Kiyeong; Koo, Kyoungchoul; Hong, Seulki; Kim, Jonghoon; Cho, Byungjin; Kim, Joungho, Conference on Electrical Performance of Electronic Packaging and Systems, IEEE, 2012-10-23

4
Measurement and analysis of vertical noise coupling on low noise amplifier from on-chip switching-mode DC-DC converter in 3D-IC

Koo, Kyoungchoul; Kim, Myunghoi; Lee, Sangrok; Kim Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, pp.22 - 27, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17

5
Noise Isolation Modeling of Partial EBG Power Bus using Segmentation Method and Cavity Model in Multi-layer PCBs

Kim, Myunghoi; Koo, Kyoungchoul; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17

6
Vertical Noise Coupling from On-chip Switching-Mode Power Supply in a Mixed-Signal Stacked 3D-IC

Koo, Kyoungchoul; Kim, Myunghoi; Kim, Joungho, DesignCon2012, DesignCon2012, 2012-02-01

7
Vertical Noise Coupling on Wideband Low Noise Amplifier from On-chip Switching-Mode DC-DC Converter in 3D-IC

Koo, Kyoungchoul; Lee, Sangrok; Kim Joungho, 8th International Workshop on Electromagnetic Compatibility of Integrated Circuits, EMC 2011, 2011-11-07

8
Vertically Alternating Impedance Electromagnetic Bandgap (VAI-EBG) Structure for Noise Mitigation in Multi-layer PCBs

Kim, myunghoi; Koo, Kyoungchoul; Kong, Sunkyu; Bae, Bumhee; Lee, Sangrok; Kim Joungho, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17

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