Decoupling Capacitor Stacked Chip (DCSC) in TSV based 3D-ICs

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Publisher
EPEP 2011
Issue Date
2011-10-24
Language
ENG
Citation

20th Conference on Electrical Performance of Electronic Packaging and Systems

URI
http://hdl.handle.net/10203/170940
Appears in Collection
EE-Conference Papers(학술회의논문)
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