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Showing results 1 to 7 of 7

1
A Fast Channel Simulation Method including Internal PDN Noise of Pseudo-differential Receiver Buffer

Kim, Hee Gon; Choi, Su Min; Kim, Jong Hoon; Jung, Daniel Hyunsuk; Lee, Hyun Suk; Cho, Kyung Jun; Kim, Joung Ho, 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 8th 2015 Korea-Japan Joint Conference on EMT/EMC/BE (KJJC), 2015-11-23

2
Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box

Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10

3
Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test

Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; et al, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27

4
Detection of open and short faults in 3D-ICs based on through silicon via (TSV)

Piersanti, Stefano; De Paulis, Francesco; Orlandi, Antonio; Jung, Daniel Hyunsuk; Kim, Joungho; Fan, Jun, IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMCSI 2017, pp.405 - 410, Institute of Electrical and Electronics Engineers Inc., 2017-08

5
Electrical characterization of bump-less high speed channel on silicon, organic and glass interposer

Lee, Hyunsuk; Kim, Hee-Gon; Kim, Kiyeong; Jung, Daniel Hyunsuk; Kim, Jonghoon J; Choi, Sumin; Lim, Jaemin; et al, 2014 IEEE International Symposium on Electromagnetic Compatibility, EMC 2014, pp.850 - 854, Institute of Electrical and Electronics Engineers Inc., 2014-08

6
Eye-diagram estimation using equivalent circuit model of coupled microstrip channel on high-speed and wide I/O Channel for 2.5D and 3D IC

Choi, Sumin; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Lim, Jaemin; Lee, Hyunsuk; et al, 20th IEEE Workshop on Signal and Power Integrity, SPI 2016, Institute of Electrical and Electronics Engineers Inc., 2016-05-08

7
TSV-based Current Probing Structure using Magnetic Coupling in 2.5D and 3D IC

Kim, Jong Hoon; Jung, Daniel Hyunsuk; Kim, Hee Gon; Kong, Sun Kyu; Choi, Su Min; Lim, Jae Min; Kim, Joung Ho, 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015 International Workshop on Electromagnetic Compatibility of Integrated Circuits (EMC COMPO), 2015-11-11

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