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Showing results 1 to 4 of 4

1
Disconnection failure model and analysis of TSV-based 3D ICs

Kim, Joungho; Joohee Kim; Heegon Kim; Jonghoon J. Kim; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10

2
Noise Coupling of Through-Via in Silicon and Glass Interposer

Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29

3
Noise Coupling of Through-Via in Silicon and Glass Interposer

Kim, Joungho; Jonghyun Cho; Joohee Kim; Jiseoung Kim, 63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810, ECTC2013, 2013-05-19

4
Optimized Inverter Design of Ring Oscillator based Wafer-Level TSV Connectivity Test (RO-TSV-CT)

Kim, Joungho; Joohee Kim; Daniel H. Jung; Junho Lee; Kunwoo Park, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10

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